Variosystems USA introduces CSP and BGA Underfill Process
On a circuit board, a BGA or a CSP is connected to electrodes by means of solder balls. Stresses such as heat cycling, shock, or bending can cause the connection of the BGA or CSP to be broken.
To prevent this, underfill is applied to the clearance space between the BGA or CSP and the circuit board; this helps to relax the stress and to hold BGA or CSP in place.
Variosystems USA implemented the Dispense Jet – High Speed Jet Dispensing DJ9000 Underfill process to fulfill customers requirements in November 2013.