Facility Sri Lanka:
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Facility China:
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Variosystems USA introduces CSP and BGA Underfill Process

On a circuit board, a BGA or a CSP is connected to electrodes by means of solder balls. Stresses such as heat cycling, shock, or bending can cause the connection of the BGA or CSP to be broken.

To prevent this, underfill is applied to the clearance space between the BGA or CSP and the circuit board; this helps to relax the stress and to hold BGA or CSP in place.

Variosystems USA implemented the Dispense Jet – High Speed Jet Dispensing DJ9000 Underfill process to fulfill customers requirements in November 2013.

 

Click here for full article and pictures

 
Member of Swiss Aerospace Cluster: www.swiss-aerospace-cluster.ch