Variosystems is pleased to announce the acquisition of the Valor’s Trilogy 5000 DFx tool providing over 700 design checks. The two main goals is to provide quicker prototype runs by finding problems before production and to help our customers eliminate board redesigns by detecting problems before the first prototype is built.
From the Valor website: “Valor DFM is a unique ‘predictive engineering’ solution where the needs of design and manufacturing come together. It rationalizes the requirements of the electrical engineer and manufacturers who need to build the boards with ‘zero defects, first time’, while balancing functional constraints with prototype, pre-production, and volume production yields. Valor DFM is comprised of more than 700 design checks covering all stages of the design cycle.”
A vital aspect of the Trilogy solution is the Valor Part Library (VPL) contains more than 35 million commercial electronic component part-numbers and their dimensioned package models containing accurate graphical contour, pin contact areas and positions, dimensional tolerances, attributes such as overall dimensions including height, pin 1 identification and much more. VPL supports the full virtual “prototyping” of products. This provides for fast off-line simulations to validate physical design characteristics against assembly and test constraints even before a first article or pilot run. With the “as-built” dimensionally accurate package data you can validate critical manufacturing processes in advance, such as solder-joint formation, test-point accessibility, pick-and-place constraints, re-work accessibility, and much more.
A unique feature of the Valor software is the “sharelist” that allows precise feedback to the design engineer. Sharelist captures selected DFM analysis results and packages them in an open document format for effective engineering collaboration. Combining graphical, text, and numerical data records, Sharelist also includes user comments and suggestions. Output formats include HTML, XML and formatted ASCII.
